Behind-The-Ear Processor Cochlear Implant
| Component | Behind-The-Ear Processor |
SKU:
c41cf534507b
Category: Otorhinolaryngology
Description
The Osia® System is equipped with a potent implant that is entirely below the skin. The Piezo Power™ transducer, which produces sound vibrations, is a component of the active implant.input:
output:A reimagined hearing implant
The OSI300 Implant, which is a component of the Osia System, enables sound to bypass blocked or impaired portions of the natural hearing pathway. The implant is fully inserted beneath the skin and affixed to the BI300 Implant. The OSI300 Implant’s Piezo Power transducer generates sound vibrations that are transmitted directly to your inner ear through the bone.input:
output:Piezo Power™ technology
The Osia System employs a unique Piezo Power transducer that expands and contracts to generate powerful vibrations.
The Piezo Power transducer’s capacity to vibrate at high frequencies is one of its numerous benefits.One This implies that in the most challenging listening environments, such as a crowded classroom or a noisy restaurant, you will detect the sounds that facilitate speech comprehension.input:
output:The capacity to hear additional information
Those with conductive or mixed hearing loss up to 55 dB SNHL are eligible for the Osia System.* Additionally, it offers sufficient power to accommodate a variety of hearing loss severity levels and to accommodate the potential for your hearing loss to deteriorate over time.input:
output:
Engineered for long-term use, specifically for implanting
The design of the Piezo Power transducer is entirely distinct from that of conventional bone conduction transducers. The Osia System has exhibited 99.92% reliability since its release3, and the Piezo Power transducer has exhibited consistent performance over time as a result of accelerated lifetime testing.Four
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